What is Thermal Management?

Thermal Management circuit materials are available in both single and double layer that considers heat transfer as a design requirement. Thermal Management takes advantage of the economics of surface mount and chip and wire bare dice technologies. It is a weapon on the war on heat.

As devices get smaller and power becomes higher, electronics designers need to continually challenge traditional methods of design to develop more reliable product designs. Thermal Management material is one such tool in this process. With this you can isolate and mount a T-220 with 20% of the thermal resistance generated in conventional assembly methods. Direct die mount and wire bonding are possible. With this process, the heat goes out while the power goes up. Lower die temperature means more durable products.

This Will Allow You To:

• Use surface mount designs and reduce printed circuit real estate
• Manage heat dissipation
• Improve reliability and durability
• Reduce hardware and assembly costs
• Replace fragile ceramics
• Reduce production costs
• Add design flexibility
• Establish durability
• Have design flexibility
• Improve product thermal and physical performance - combine power and control

"GSPK Circuits Ltd - one of the preferred UK and European suppliers of Bergquist Materials."

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